Replacing and Enhancing Competitor's Obsolete Microcircuits
Looking For a Solution to Procure a Unique or Obsolete Component? DATEL Specializes in Replacing and Enhancing Obsolete Microcircuits.  As a premier designer and manufacturer of Data Acquisition Systems and components for over 40 years, DATEL is frequently approached by our customers to help them resolve obsolescence, End-of-Life (EOL) and/or reduced access to qualified legacy products.  We are uniquely positioned to provide alternative solutions to on-going and mature defense and aerospace programs which suffer from Diminishing Supplier-Base issues.
DATEL has decades of design and manufacturing expertise in digital and analog products for the Commercial, Industrial, Medical and Military/Aerospace markets by offering:
- Standard, special or custom products
 - Form-Fit-Function for obsolete products
 - Low volume and high volume applications
 - No obsolescence - DATEL products are guaranteed to be available for long-term programs
 - Available RoHS and Non-RoHS versions of products/systems
 - All commercial, industrial, medical and military grades of products are produced in our Mansfield-based MIL-PRF-38534 certified facility
 - Hermetically sealed packaging
 - In house environmental testing
 
DATEL Manufacturing Capabilities
Chip and Wire on Ceramic
Operating from our 180,000  square foot facility in Mansfield, Massachusetts, we have been producing  Mil-certified Data Acquisition components since 1970. The hermetically sealed components  are assembled in our class 100,000 clean room on thick-film substrates, and all  Hi-Rel products are fully tested over their extended operating temperature  range.
- Full MIL-PRF-38534 Class H, ISO 9001:2008 certified and compliant facility
 - Die attach process - conductive and non-conductive epoxies
 - Wire Bonding - 1 mil Au wire
 - Seam Seal - welded lid
 - Conducted in a class 100,000 clean-room
 - Hi-Reliability commercial, industrial and MIL-883 electronic components
 - ROHS and non ROHS compliant processes are available
 
Chip-Wire and SMT on FR4
 
To provide the smallest packages at the lowest cost we have introduced a  new form of Hybrid, incorporating chip-wire and SMT technology on FR4, housed  in Mini SMT Quad-Pak or traditional TDIP.
- Die attach with 1 mil Au wire bonding
 - Mini SMT Liquid Crystal Polymer Quad-Pak
 - Commercial and extended temperature range testing
 - ROHS and non-ROHS compliant processes are available
 
Surface Mount Technology
 
Commercial products not  requiring hermetically sealed packaging can be manufactured using SMT  technology to provide the same performance but at a lower cost. 
- Auto pick and place
 - Manual pick and place
 - AOI inspection
 - Lot control verification
 - Auto pin insertion
 - High-temp solder assembly
 - Through-hole assembly
 - Flying leads
 - Encapsulation
 - ROHS or non-ROHS compliant
 
Thick Film
 
Hermetically sealed  products manufactured in our Class 100,000 clean room are assembled on  thick-film substrates. 
- Conductor, dielectric, glassivation, resistor pastes
 - Single- or multi-layer
 - Thick film resistors screened onto the substrate
 - RoHS and non-RoHS compliant
 
Test & Environmental
 
All  products, whether using chip-wire, chip-wire and SMT, or solely SMT, are fully  tested to their specified static and dynamic parameters. Hi-Rel devices are  fully tested under their specified extended temperature ranges. An MES tracking  system monitors each step of the manufacturing process and records all test  results, providing lot control and traceability for all data acquisition  products.                                                        
- Dynamic FFT & static ATE
 - Extended temperature testing
 - Burn-in
 - Temp cycling
 - Centrifuge
 - PIND
 - Hermeticity testing
 - Life test
 
Facility Quality Standards
MIL-PRF-38534  Qualified - Quality Assurance Manual
 - ISO-9001 Registered
 - ISO 14001 certification
 - MES tracking system
 - Lot control and traceability on all Data Acquisition products
 - Company-wide, continuous improvement programs
 
