Manufacturing Capabilities

Chip and Wire on Ceramic

Operating from our 180,000 square foot facility in Mansfield, Massachusetts, we have been producing Mil-certified Data Acquisition components since 1970. The hermetically sealed components are assembled in our class 100,000 clean room on thick-film substrates, and all Hi-Rel products are fully tested over their extended operating temperature range.

Chip-Wire and SMT on FR4

To provide the smallest packages at the lowest cost we have introduced a new form of Hybrid, incorporating chip-wire and SMT technology on FR4, housed in Mini SMT Quad-Pak or traditional TDIP.

Surface Mount Technology

Commercial products not requiring hermetically sealed packaging can be manufactured using SMT technology to provide the same performance but at a lower cost.

  • Auto pick and place
  • Manual pick and place
  • AOI inspection
  • Lot control verification
  • Auto pin insertion
  • High-temp solder assembly
  • Through-hole assembly
  • Flying leads
  • Encapsulation
  • ROHS or non-ROHS compliant

Thick Film

Hermetically sealed products manufactured in our Class 100,000 clean room are assembled on thick-film substrates.

  • Conductor, dielectric, glassivation, resistor pastes
  • Single- or multi-layer
  • Thick film resistors screened onto the substrate
  • RoHS and non-RoHS compliant

Test & Environmental

All products, whether using chip-wire, chip-wire and SMT, or solely SMT, are fully tested to their specified static and dynamic parameters. Hi-Rel devices are fully tested under their specified extended temperature ranges. An MES tracking system monitors each step of the manufacturing process and records all test results, providing lot control and traceability for all data acquisition products.                                                       

  • Dynamic FFT & static ATE
  • Extended temperature testing
  • Burn-in
  • Temp cycling
  • Centrifuge
  • PIND
  • Hermeticity testing
  • Life test

Facility Quality Standards


DATEL, Inc. is a leading supplier of High Precision Data Acquisition Components and DC to DC converters. Our leadership status in high-performance data acquisition components is unchallenged, driven in large part by our engineering expertise to develop solutions with outstanding electrical performance, small packaging, low power consumption and ease of use. These products employ five basic technologies: monolithic IC, thin-film hybrid, thick-film hybrid, SMT technologies and discrete component circuit.

DATEL's DC DC converter product line includes non-isolated point-of-loads dc/dc, switching regulators as well as a complete line of industry standard brick packages (Sixteenth-Brick, Eighth-Brick, Quarter-Brick, Half-Brick and Full-Brick) and railway dc-dc converters.

Diminishing Manufacturing Sources and Material Shortages (DMSMS): We have the solution to your Diminishing Manufacturing Sources and Material Shortages (DMSMS) component problems. DATEL has the design knowledge and manufacturing capabilities to provide alternative solutions to on-going and mature defense and aerospace programs which suffer from Diminishing Supplier-Base issues.